Introduction

Zen Voce corporation established in April 1999, we are a professional manufacturer specializing in semiconductor packaging testing equipment and fixtures. Starting from 2001, we began to develop and manufacture semiconductor Memory testing fixtures. We have since expanded into the production of semi-automatic single-spindle cutting machines for semiconductor wafers/LEDs and 12" fully automatic dual-spindle cutting machines. We have also ventured into large substrate BGA (Ball Grid Array) ball placement machines and dual-spindle fully automatic Singulation Saws. In addition to our in-house developed equipment, we also act as agents for semiconductor burn-in test connectors, MEMS equipment, solar equipment, and LCD inspection equipment. We provide comprehensive technical services to meet the expectations and needs of our customers, becoming a leading indicator in the global semiconductor, optoelectronic, microelectronics, and LCD equipment industries.

Equipment Products

IC packaging machine design and manufacture of bumping
Wafer cutting machine and cleaning machine design and manufacturing
Board cutting machine and cleaning machine design and manufacturing

 

Test Products

Wafer test probe card PCB design and manufacturing
IC test HIFIX and CHANG KIT design and manufacturing
SOCKET IC design and manufacturing test
Acting IC HANDLER
Acting SOCKET IC burn-in test