BGA/SCP/FCBGA Fully-Automatic Solder Ball Mounter –ZV388Plus

BGA/SCP/FCBGA Fully-Automatic Solder Ball Mounter –ZV388PlusBGA/SCP/FCBGA Fully-Automatic Solder Ball Mounter –ZV388Plus

Specification: 

Substrate dimension up to : 300mm X 100mm 

Carrier dimension up to : 325mm X 170mm 

Placement Area up to: 300mm X 130mm 

Solder Ball sizes for substrate: 0.15mm and above. 

Ball Pitch for substrate: 0.3mm and above. 

Solder Ball sizes for Carrier : 0.20mm and above. 

Solder balls per mount: ≦ 80,000 balls. 

Production Yield: ≧ 99.9%(0.30mm above ball size) 

Placement Accuracy: < 1/3 ball diameter 

 

Product Specifications

The ZV 388Plus Solder Ball Mount System is a fully automatic machine developed for BGA/CSP/FCBGA process applications.

Key Features:

  • Solder Ball Sizes/Pitch: As small as 0.15mm in diameter.
  • Handling: Proprietary design eliminates damages to solder spheres.
  • Product Setup: Rapid product changeover with quick-change product tooling.
  • Supported: SEC S/GEM200, GEM300 Standard, and WebAPI.
  • Certified: SEMI S2/S8.