Zen Voce

-	Contract Manufacturing & Services

Wafer Test

~	Zen Voce Probe Card PCB

Dicing

~	Zen Voce Dicing Machine
~	Zen Voce Tape Mounter
~	Zen Voce Wafer Cleaner

Encapsulation/End-of-Line

~	ZVM-380 BGA/CSP Sphere Attach System
~	MMS-388 Wide Width BGA/CSP Sphere Attach System
~	ZV-30 Wafer Bumping
~	Post Reflow Inspection
~	Toolings

Test

~	Zen Voce Hifix (iTIS)
~	Zen Voce Change Kits
~	Zen Voce Load board
~	Test Contactors – Contact Fingers
~	Test Contactors - Pogo Pins
~	Thermal Management

HDD

~	HDD Cover Epoxy Dispensing System

Fasteners

~	FIH-3000 Series Fastener Inspection Handler
~	NIH-2000 Series Nut Inspection Handler

•	Events
•	Careers

Distribution: Test & Burn-in

Test & Burn-in: Sensata Burn-in Socket

•	It is for the burn in process interface parts
•	Connect between burn in boards & IC
•	Can be applied to all different IC by changing different socket
•	Good quality and service will be your best favor

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Test: TSE - Integrated Test Interface Solutions (iTIS) Board

An iTIS unit, manufactured by TSE, is the electro-mechanical interface solution between ATE (Automatic Test Equipment) and package handler as well as probe station. An iTIS is a key component for accurate device test.
It is the equipment that connects the ATE(Automatic Test Equipment) to the handler electrically and mechanically in order to test the semiconductor devices.
The mechanical efficiency of the iTIS board allows the DUT to make contact with the iTIS board socket with pinpoint accuracy.
The role of this board is crucial. Even a high line ATE costing sub million cannot operate efficiently if it is not supported by a quality iTIS board. As semiconductor devices are being developed at higher speeds, the interface board is becoming more valuable.

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Test: TSE – Change Kits

The Change Kit is the essential part of a handler and is needed to test the various types of packages. The Change Kit has lots of applicable forms, because a different handler requires a different application, each Change Kit must be designed specifically for the each handler and the each package.
A Handler change kit consists of a device change kit and a customer tray kit.
The Change Kits are design to work best with the handlers, packages, sockets and interface boards, and has been producing the high performance and low cost Change Kits for the various types of handlers. These Change Kits are able to achieve (produce) the highly accurate and highly reliable results through the accurate testing.

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Test: NRT – Camera Module Assembly System

This is a new automatically Test & Manufacture CMOS Module for Mobile phone and is possible to apply to several types of CMOS Module with a slight modification. This system is unique for its compatibility.

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Test: ETEC MEMS Test System

•	A turnkey system for characterizing motions of MEMS / MOEMS
•	Typically made up of Sensing or Actuating element, control/communication and Calibration ASIC
•	Analyze an individual microstructure , or arrays of microstructures, simultaneously (full field of view analysis)
•	Combines video microscopy, stroboscopic illumination, profilometry and interferometric measurements
•	Measure in 3-dimensions, 6 degrees of freedom (tip/tilt & displacement)

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Test: ECA EC36 Rotary Sorting & Test Handler

•	A fully automated turret consisting of 24-station pick up coupled with 12 station secondary rotary table
•	Allows customized configuration
•	Specially designed to cater for packages like MLPM, MLPH, QFN, MLF and SOT
•	Can produce throughput of 24,000 to 36,000 depends on the package type and size
•	Vision system is specially integrated into the system to provide a comprehensive range of inspection solutions

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