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| Wafer Test: |
probeWoRx® 300 System w/ fast 3D-OCM
the Next Generation Metrology System |
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Product Overview
The probeWoRx System w/ fast 3D-OCM is the next generation probe card production metrology system. Featuring Applied Precision's "Hi-Speed 3-dimensional Optical Comparative Metrology" at its core, this revolutionary new technology enables a breakthrough in overall system performance for both speed and accuracy. The probeWoRx system delivers lightning-fast test times (10x faster than current industry standards), higher accuracy and repeatability, and the ability to measure the largest and most complex probe cards in "one-touch" with fully automated "lights-out" operation. This is the first probe card metrology system to perform all necessary testing for both Fabs and probe card manufacturers at the highest speeds, with no compromise to accuracy or repeatability, eliminating the probe card testing bottlenecks of the past. Taking your test times from hours to minutes. |
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What is fast 3D-Optical Comparative Metrology (OCM) Technology?
The fast 3D measurement technology is enabled by our Optical Comparative Metrology-a unique proprietary optical technology that allows probeWoRx to measure all probes optically relative to a fiducial grid at zero overtravel and at overtravel. Probes are viewed through a NIST traced photolithographically manufactured glass which is extremely flat and accurate. So measurements are independent of stage accuracy. After optically measuring the probes, the probeWoRx system compares the probe positions to the fiducial grid to compute the 3-dimensional probe position. The Optical Comparative Metrology process enables greater than 10X faster planarity and alignment measurements compared to conventional probe card analyzers. Optical Comparative Metrology reduces test times from hours to minutes for even the largest most complex probe cards. |
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Speed and Accuracy - "Going from hours to minutes"
The combination of fast 3D-OCM Technology and improved testing accuracy and repeatability allows a breakthrough in the reduction of total test time for even the most advanced large area array probe cards - going from hours to minutes.
The probeWoRx system's high baseline accuracy is dependent on the fiducials, not on the accuracy of a mechanical stage, thus eliminating the need for time-consuming stage calibrations. Furthermore, the measurement standard (fiducial grid) and probes are co-located so the ruler is always in every captured image, virtually eliminating any Abbe error. The increased loads of today's probe cards impact structural deflection and degrade accuracy, while at the same time their tighter probe pitches and smaller pads require higher accuracy. The unique combination of fast 3D-OCM technology and new software enables unprecedented accuracy and repeatability over a wide range of array sizes (up to 300mm diameter). In addition, the probeWoRx system has improved speed, accuracy and repeatability for all electrical measurement capabilities (Cres, leakage, wirechecker, probe force, capacitance and capacitor) related to the testing of probe cards. |
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probeWoRx Capabilities
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Large Arrays & Probe Cards |
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Maximum array size = 300 diameter |
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Maximum probe card size = 558.8 mm diameter |
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Higher Probe Force |
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Maximum probe force at over travel = 100 Kgf (220lb-force) |
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Increased Channel Count |
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Maximum measurements channels = 10,000 |
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Maximum relay channels = 1,000 |
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Probe Card Support
The probeWoRx system is designed for high throughput build, test, rework, repair and historical analysis for all probe card types (Cantilever, Vertical, Cobra, Microspring, Silicon Finger, Membrane and other advanced technologies) that support the semiconductor and probe card manufacturing processes. Special circuit protection with current and voltage clamping provides specific current and voltage settings for the probe card and can be tied to each probe card test recipe.
[Contact us for more info] |
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| Wafer Test: |
PrecisionPoint VX3
Test Floor Managers' No. 1 Choice Worldwide |
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Product Overview
Since its introduction, the PrecisionPoint VX platform has been the industry standard for dependable test, analysis and rework of your probe cards. Now, the PrecisionPoint VX3 carries on this tradition, with unsurpassed probe card metrology for the latest probing technologies and increased testing capabilities that support the Semiconductor fine pitch roadmap requirements. When you choose the PrecisionPoint VX3 system, not only can you test tighter pitches and smaller probe tips, you can be confident that you're using the world's leading probe card analyzer. |
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What is the VX3 "Plus"?
The VX3 "Plus" provides the necessary capabilities to support the continual need to shrink pad sizes, probe pitches and probe tip sizes. Our customers are increasing Multi-DUT testing so more devices can be tested simultaneously, which lowers the overall cost per die being tested. To achieve this they require new probe card technologies with smaller probe tip sizes and tighter pitch requirements. Applied Precision continually develops new capabilities supporting our customers' roadmap requirements and delivers them with the PRVX3 "Plus". |
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The VX3 "Plus" provides:
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Increased testing capabilities in line with our customers' technology roadmaps |
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Upgradability - every PRVX and PRVX2 can be upgraded to the PRVX3. AP offers many upgrade configurations to fit our customers' needs financially and technically. |
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State-of-the-art technology that allows our customers to maintain their competitive advantage. |
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Decreased overall cost of ownership regardless if they are upgrading or purchasing new through: |
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PRVX and PRVX2 to VX3 upgrade packages priced for maximum customer value |
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Introduction of the new "Standard Motherboard" |
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Customer Interface product investment protection - Forward and Backwards compatibility with customers' Custom Interface product investments. Most PRVX and PRVX2 Custom Interface Products can be used on every PRVX3 system available from Applied Precision. |
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New Capabilities
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Standard Motherboard |
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Ultra Fine Tip Checkplates |
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1 mil Dot and 1 mil Post |
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Auto Reference File Builder |
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Continued leadership in Upgradability |
[Contact us for more info] |
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| Wafer Test: |
waferWoRx® Probing Process Analysis System
Automated Root Cause Analysis and Results for Rapid Probing Process Improvement |
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Product Overview
Accurately probing the wafer and hitting the center of the pad is critical to the probing process and ultimately your bottom line. Typically a decrease in yields is the first sign that your process is not working. Actually quantifying and evaluating the performance of the prober, probe card and probe card analyzer is difficult and time-consuming, often requiring tedious analysis. Imagine a new metrology standard, one that revolutionizes the back-end's current methods of bringing new complex technologies on-line and managing the wafer probing process. The waferWoRx Probing Process Analysis System enables automated root cause analysis for rapid corrective action, yield optimization and control, and new technology validation for the wafer probing process. |
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Proprietary Algorithms Increase Analysis Scope and Accuracy
The wafer testing process operates as a fine-tuned system only when a robust sampling and testing methodology is applied to qualify, optimize and monitor each variable. Thorough analysis of the probe mark can reveal the true performance under actual test conditions of the prober, probe card and probe card analyzer. The waferWoRx Probing Process Analysis System replaces time-consuming manual analysis with proprietary algorithms, which collect quantifiable data and deliver easy-to-interpret results.
The waferWoRx System uses an automated process to capture high-resolution images from production wafers. Precision mechanics, highly accurate optics and easy-to-use software automatically scan each wafer to create a user-defined data set for analysis. To ensure superior resolution during the imaging process, we combined a multi-featured high-resolution microscope with a CCD camera and sophisticated image-processing technology.
The waferWoRx system provides data on over 40 parameters assessing the position, size and angle of the probe mark and whether the probe mark affects optimal wire bonding. Our advanced software can determine additional parameters including prober stage accuracy, prober set-up errors and probe card performance. The software graphically reports on the accuracy and repeatability of the test process for each of these parameters based on user-defined pass/fail criteria.
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Automated Root Cause Analysis Enables Rapid Corrective Action
When the probing process breaks down it can be difficult to find the root cause. It is critical to rapidly correct the problem and get back online, yet analyzing the process is labor intensive and complex. With the waferWoRxTM system, targeted root cause analysis is quick and easy. The waferWoRx system automatically generates a process report card, an easy-to-read visual report indicating process efficiencies and deficiencies, eliminating guesswork.
Specifically, this analysis provides data on the accuracy of the prober stage, performance under high load and test-at-temperature, all of which are critical for a successful probing process. With the root cause(s) defined, efforts can be focused on rapid corrective action and returning to full production. |
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The combination of the process report card (left) and associated wafer views (below) indentify potential errors or problem areas that can be addressed. |
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As the prober stage moves in the Y-axis, an X-positioning error is caused by errors in wafer alignment and stage orthogonality. |
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As the prober stage moves in the X-axis, a Y-positioning error is caused by errors in wafer alignment and stage orthogonality. |
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Pad damage over the wafer is displayed with an indication of slightly less damage on the lower right side. |
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Optimize Processes for Higher Yields
Once the wafer probing process is performing correctly, optimizing for yield and controlling the probing variables is essential. With the waferWoRx system Cpk and SPC Analysis can be used to monitor the process and proactively manage production quality.
Through multiple wafer analysis the system determines trends over time and evaluates process repeatability as well as operator variability. Leveraging this information optimizes the probing process and helps achieve higher yields, greater equipment utilization and increased process latitude. |
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Assess Readiness for Complex New Technologies
The industry's push to produce more chips on each wafer requires die pad size to shrink, placing considerable pressure on probing accuracy. Feedback from the waferWoRx system can validate your process readiness for the incorporation of increasingly complex probing technology including multi-DUT and high pin-count probe cards, high-probing loads and test-at-temperature performance.
The waferWoRx system can validate if a current prober is capable of testing a new product design, enabling new processes to be up and running more efficiently and effectively. When incorporating new technology, the waferWoRx system can help engineering determine optimal pad sizes and pitches with quantifiable data from current processes. With the waferWoRx Probing Process Analysis System capital equipment purchases can be planned for and accomplished in tandem with new roadmap technologies. |
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Closed-Loop Metrology (Process Control)
When networked with Applied Precision's waferWoRx Probing Process Analysis System, probeWoRx® provides valuable closed-loop process monitoring capabilities. The probeWoRx system supports probe card production process verification, performance analysis, and maintenance for 150mm, 200mm and 300mm probing process requirements. An optional Historical Probe Card Analysis software module provides fast, intuitive data-mining of probe card test results for trend analysis and Cpk process calculations.
[Contact us for more info]
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| Wafer Test: |
ATM-Probe Card Aqueous Cleaning System |
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ATM PC 102 was designed for thorough non-contact, non-abrasive cleaning of high density vertical probe cards. Thorough and proper cleaning will lower contact resistance and result in high probe yields. The PC1000's non-contact, non-abrasive cleaning process will increase probe card life and reduce probe card maintenance costs. As probe tip geometry and test voltages are constantly reduced, the importance of probe cleanliness is paramount in minimizing the need for retest and to insure maximum device yield.
[Contact us for more info] |
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| Wafer Test: |
ZVM-Probe Bending Machine |
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The Probe Bending Machine is designed to bend probes and sort them according to the probe tip length and angle by using vision system. It is design to improve the probe pin yield and increase productivity. It can handle pin as small as 4mil pin diameter and tip length from 10mil to 80mil.
[Contact us for more info] |
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| Wafer Test: |
AMST Vertical Probe Card |
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Show applicability of simple Micro-cantilever probe for Semiconductor testing |
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Great design freedom of the cantilever(position, length, width, thickness); No plastic deformation |
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Single Crystal Silicon Cantilever |
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Semiconductor fabrication process |
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High resilience |
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Fine pitch possible |
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Repairable by replacement of defective block |
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Large Area Probing Possible |
[Contact us for more info] |
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