Zen Voce

-	Contract Manufacturing & Services

Wafer Test

~	Zen Voce Probe Card PCB

Dicing

~	Zen Voce Dicing Machine
~	Zen Voce Tape Mounter
~	Zen Voce Wafer Cleaner

Encapsulation/End-of-Line

~	ZVM-380 BGA/CSP Sphere Attach System
~	MMS-388 Wide Width BGA/CSP Sphere Attach System
~	ZV-30 Wafer Bumping
~	Post Reflow Inspection
~	Toolings

Test

~	Zen Voce Hifix (iTIS)
~	Zen Voce Change Kits
~	Zen Voce Load board
~	Test Contactors – Contact Fingers
~	Test Contactors - Pogo Pins
~	Thermal Management

HDD

~	HDD Cover Epoxy Dispensing System

Fasteners

~	FIH-3000 Series Fastener Inspection Handler
~	NIH-2000 Series Nut Inspection Handler

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•	Careers

Distribution: Wafer Test

Wafer Test:

ZVM-Probe Bending Machine

The Probe Bending Machine is designed to bend probes and sort them according to the probe tip length and angle by using vision system. It is design to improve the probe pin yield and increase productivity. It can handle pin as small as 4mil pin diameter and tip length from 10mil to 80mil.

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Wafer Test:

AMST Vertical Probe Card

•	Show applicability of simple Micro-cantilever probe for Semiconductor testing
•	Great design freedom of the cantilever(position, length, width, thickness); No plastic deformation
•	Single Crystal Silicon Cantilever
•	Semiconductor fabrication process
•	High resilience
•	Fine pitch possible
•	Repairable by replacement of defective block
•	Large Area Probing Possible

[Contact us for more info]

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