Versatile dicing capability. From ∅2” wafer to ڤ12” multi-panel substrates dicing applications, TS series die saw alternatively equipped with 1.2kW(2” blades) or 2.4kW(2~4” blades) can process a wide variety of materials. No matter ultra-thin silicon wafer, BGA/CSP/QFN substrates, thick glass, bevel cut or SMD substrates, TS series can be optimized to customers' demands
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Superior dicing quality. Gantry frame & front-mounted spindle optimize structure rigidity to isolate vibration. Hence TS series die saw can carry-out superior and consistent dicing quality
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High throughput system. Faster axis speed and highly automatic functions including auto-alignment, auto kerf check and non-contact setup make TS series spends more time on dicing, not on preparation, also reducing operation errors. Hence TS series die saw is an cost effective system
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System utilization. Safety checks, including blade breakage detector, facilities check, prevent any wafer, blade and machine from damage, also keeping production 7x24 continuously running
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Production statistics. Built-in data log to record all operation steps and optionally supporting bar-code reader and network system, increase productivity and shop floor control
• High particle remove rate by water jet • Versatile cleaning for wafer, glass and substrate • Static-charges removed by ion-fan & CO2 re-ionizer • Touch screen operation & recipes storage • Small footprint saving space cost • Built-in safety interlock & self-diagnostic functions
