Zen Voce

-	Contract Manufacturing & Services

Wafer Test

~	Zen Voce Probe Card PCB

Dicing

~	Zen Voce Dicing Machine
~	Zen Voce Tape Mounter
~	Zen Voce Wafer Cleaner

Encapsulation/End-of-Line

~	ZVM-380 BGA/CSP Sphere Attach System
~	MMS-388 Wide Width BGA/CSP Sphere Attach System
~	ZV-30 Wafer Bumping
~	Post Reflow Inspection
~	Toolings

Test

~	Zen Voce Hifix (iTIS)
~	Zen Voce Change Kits
~	Zen Voce Load board
~	Test Contactors – Contact Fingers
~	Test Contactors - Pogo Pins
~	Thermal Management

HDD

~	HDD Cover Epoxy Dispensing System

Fasteners

~	FIH-3000 Series Fastener Inspection Handler
~	NIH-2000 Series Nut Inspection Handler

•	Events
•	Careers

Standard Solutions: Encapsulation/End-of-Line

Encapsulation/End-of-Line:
ZVM-380 BGA/CSP Sphere Attach System

The ZVM-380 BGA/CSP Sphere Attach System is highly sophisticated and fully automatic equipment that is capable of handling high volume production of all forms of BGA and CSP packages with either single pass or through step-and repeat operations. This is an integrated system that transfers flux and solder spheres to substrates with high placement accuracy and reliability. A truly industrial PC-based controller designed with a user-friendly graphical interface that simply guide user to obtain optimal process control and quick changeover.

The in-house developed post mount inspection system automatically detects in-process defects like missing, misplaced and incorrect solder sphere sizes. Other equipment includes magazine loader, oven diverter, and accumulator-cum unloader and post reflow inspection.

•	Cater for both normal & large substrate (Up to 300mm X 80mm substrate)
•	Capable to handle both substrate and singulated devices
•	Capable to handle super small ball size (0.20mm) and pitch (0.4mm)
•	Capable to handle up to 30K ball
•	Consistency flux transferred is obtain with our Proprietary Flux Pin Design
•	High placement repeatability – 0.025mm@3 sigma
•	Step & Repeat placement
•	Auto conveyor width adjustment
•	Proprietary Easy Wash flux pin design
•	WIP with vacuum capability
•	Quick & easy conversion (Less than 10mins)
•	No flux bridging
•	Eliminate double ball occurrences
•	Minimize ball oxidation
•	High production yield (Up to 99.95%)

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Encapsulation/End-of-Line:
MMS-388 Wide Width BGA/CSP Sphere Attach System

MMSi latest MMS-388 Wide Width BGA/CSP Sphere Attach System is the solution to handles singulated devices on Jdec tray, Auer boats carrier and any other customized boat carrier. Not only MMS-388 inherits the cutting edge technologies from the ZVM-380 BGA/CSP Sphere Attach System, it is also technologically re-structured and developed to vastly improve its capability and reliability to handle singulated devices on Jdec tray and carriers.

•	the robot arms can transverse at high speed to any coordinating positions accurately
•	incorporates both the vacuum and clamping methods, any amount of substrate/device warpage can be easily taken care of
•	can easily handle as many as 25,000 solder balls at a single placement
•	Current capabilities to mount solder balls up to 3x9 matrix format
•	the high-speed line-scan camera in the Post Mount Inspection Module can be moves in both x & y directions to capture the entire image
•	New processor can compute at 7000 solder balls/second with all measuring criteria, like missing, extra, diameter, pitch, distance and roundness
•	Multi-languages and user-friendly GUI allows to the users to select commands and operations with ease

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Encapsulation/End-of-Line: ZV-30 Wafer Bumping

ZV-30 Wafer Bump provides precise control of print pressure to attain consistent flux volume transfer and uniformity to wafer. MS-30 Sphere Attach applies simple and effective concept to attain highly co-planarity and repeatability snap distance between the stencils and wafer for accurate solder ball attachment. The sliding dual camera module allows user to facilitate the alignment quickly between the stencil apertures and wafer bond pads.

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Encapsulation/End-of-Line: Post Reflow Inspection

Post Reflow Inspection (PRI) is used essentially to inspect the BGA/CSP substrates or singulated devices for missing ball, diameter, extra, pitch, distance and roundness after flowing out from the reflow oven.

It uses a high-speed line scan camera that capture the entire image in a shortest possible time and process at 7000 solder balls in a second. It can handle solder ball as large as 1.0mm down to as small as 0.2mm. PRI is applicable to both eutectic and lead-free solder balls.

It uses an industrial PC with Window 2000 as the main controller. The multi-languages and user-friendly GUI allows user to select commands and operations with ease.

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Encapsulation/End-of-Line: Toolings

Toolings are the most important part of the BGA/CSP ball mounting operation. As such, the design, quality and the choice of material used for the tooling are of paramount importance.

Over years of experimenting and experience, we have determined that brass and graphite are the ultimate choice for making the template and ball tooling. The template and ball tooling are precisely produced to ensure that solder balls of all sizes are accurately pick and transferred to the substrates. In order to improve the life span and resistance to wear and tear, special processing and coating are required.

In the flux tool, the flux pins are specially designed to ensure constant volumetric of flux being transferred to the substrates and to eliminate flux bridging. The flux pins are spring compliance to handle any local warpage of the substrate. It is also designed with slots and holes to allow easy wash-and-dry.

The ultimate rib-cage WIP plates are used to handle severely warpage substrates. The WIP plates make the substrates flat prior to flux transferred and balls placement.

Finally, any tooling produced must undergo a stringent QC measurement and testing before it is shipped to customers.

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