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Test: Zen Voce Hifix (iTIS) |
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It can be design for different testers and different handlers' docking |
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Good signal transfer and contact are our products' characters |
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For different IC package, our product can provide the excellent testing solution |
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Good quality and service will be your best favor |
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Test: Zen Voce Change Kits |
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Provide the best automatic tooling for different handlers and IC packages |
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Design for smooth IC transfer |
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Design for good contact and get high yield test rate |
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The excellent design and production quality will be your best selection |
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Test: Zen Voce Load board |
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Provide interface for Logic device FT testing |
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Provide interface for Mixed Signal device FT testing |
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Provide interface for RF IC FT testing |
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Provide interface for other device FT testing |
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Test Contactors |
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We provide test contactors that cover a wide range of device packages, i.e. SOP, QFN, uBGA, etc. We can provide solutions for a wide range of pin counts & pitches from 0.3 – 1.27mm. Ideal for high performance testing applications, ZV produces high quality, accurate and reliable test connections that help to reduce the cost of test. We offer test contactors for the smallest chip scale packages, with less than 100 contacts, and for the largest microprocessors, with over 1,000 contacts and handle pitches as tight as 0.3 mm.
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Test: Test Contactors – Contact Fingers |
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Zen Voce Contactors are designed for high-performance production test of integrated circuits. The designs emphasize yield-optimizing electrical performance & high reliability for high-volume production test. The contactor’s long-life & ease of maintenance preserve the investment in what is arguable the most important part of the test interface.
| Competitive Edge |
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Surface Mounted contact to allow for good interface between board & contactor. |
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Molded Body to ensure low coefficient of thermal expansion & high wear resistance |
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Molded Body to isolate the stress between device contact & board contact |
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Flat contact plate to allow for better friendliness due to package dimensions variance |
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Low capacitance, inductance & DC resistance |
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Good compliance between the device & contacts |
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Reduced contact resistance by plating all components within the pins with gold |
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The contacts are made of beryllium copper with hard gold plating to assure long life as well as better electrical performance |
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The socket body allows for device alignment with high wear resistance & low thermal coefficient of thermal expansion |
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Ease of replacement of the contacts |
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The socket body utilize coarse & fine alignment with tapered guides to ensure ease of entry |
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Test: Test Contactors - Pogo Pins |
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Wide applications for various packages like BGA, PGA, uBGA, LGA, QFN, Strip Test...etc.
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High Frequency RF Testing |
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Short pin length with short signal path designed to minimize signal distortion |
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Short electrical path through the contactor |
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Fine pitch up to 0.3mm |
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Low capacitance, inductance & DC resistance |
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Test: Thermal Management |
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Zen Voce has designed and manufactured a wide range of electronics cooling solutions to meet the unique packaging requirements of customers in a variety of industries. We help to solve complex cooling problems with integrated custom designs and advanced packaging concepts, utilizing smart-system controls that communicate by means of state-of-the-art microprocessors.
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