Semiconductor Industry

Capable of Processing Multiple Substrates in a Single Frame

Allows for processing multiple substrate packages placed within a single frame. This enables improved production efficiency by reducing workpiece exchange time and minimizing the usage of dicing tape.

Enhanced Production Efficiency

By utilizing the Dual Cut mode, which enables simultaneous cutting with dual spindles, the machine achieves up to 90% improvement in production efficiency compared to previous models (single-spindle TS1201A with a 300mm diameter).

Stable Processing Quality

By selecting the Sub Chuck Table specification, the cutting blades can be dressed (exposing the diamond grit) during the processing, accommodating square grinding plates up to 75mm in side length. This ensures stable processing quality for materials such as glass substrates, hard brittle materials, resins, and ductile metals that tend to degrade the cutting ability of the blades during the cutting process.

Length Calibration

For materials with irregular expansion and contraction, such as resin substrates, high precision processing is achieved through calibration using multiple points.

High Load Processing

Equipped with a high-torque, high-rigidity 2.4 kW spindle, the machine can handle high-load processing such as hard and brittle materials like glass and ceramics, thick workpieces, and slotting with thick blades.

User-Friendly Operation

Featuring a 15-inch screen and large operational buttons for excellent operability. Automatic calibration function allows for pre-teaching (registering cutting positions) of individual product components, enabling subsequent calibration by selecting model parameters (Device Data). Kerf Inspection: Automatically measures kerf deviation and width for quality management.

Standard Features:

• Auto Kerf Check: Automatic kerf correction
• NCS (Non-Contact Setup): Non-contact blade height measurement

Optional Features:

• Blade Broken Detector: Detects broken blades