BGA/SCP/FCBGA Fully-Automatic Solder Ball Mounter –ZV380PlusBGA/SCP/FCBGA Fully-Automatic Solder Ball Mounter –ZV380Plus
Specification:
Substrate dimension up to : 300mm X 80mm
Placement Area up to: 290mm X 70mm
Solder Ball sizes: 0.15mm and above.
Ball Pitch: 0.3mm and above.
Solder balls per mount: ≦ 45,000 balls.
Production Yield: ≧ 99.9%(0.30mm above ball size)
Placement Accuracy: < 1/3 ball diameter
Product Specifications
The ZV 380Plus Solder Ball Mount System is a fully automatic machine developed for BGA/CSP process applications.
Key Features:
- Solder Ball Sizes/Pitch: As small as 0.15mm in diameter.
- Handling: Proprietary design eliminates damages to solder spheres.
- Product Setup: Rapid product changeover with quick-change product tooling.
- Supported: SEC S/GEM200, GEM300 Standard and WebAPI.
- Certified: SEMI S2/S8.