BGA/SCP/FCBGA Fully-Automatic Solder Ball Mounter –ZV388PlusBGA/SCP/FCBGA Fully-Automatic Solder Ball Mounter –ZV388Plus
Specification:
Substrate dimension up to : 300mm X 100mm
Carrier dimension up to : 325mm X 170mm
Placement Area up to: 300mm X 130mm
Solder Ball sizes for substrate: 0.15mm and above.
Ball Pitch for substrate: 0.3mm and above.
Solder Ball sizes for Carrier : 0.20mm and above.
Solder balls per mount: ≦ 80,000 balls.
Production Yield: ≧ 99.9%(0.30mm above ball size)
Placement Accuracy: < 1/3 ball diameter
Product Specifications
The ZV 388Plus Solder Ball Mount System is a fully automatic machine developed for BGA/CSP/FCBGA process applications.
Key Features:
- Solder Ball Sizes/Pitch: As small as 0.15mm in diameter.
- Handling: Proprietary design eliminates damages to solder spheres.
- Product Setup: Rapid product changeover with quick-change product tooling.
- Supported: SEC S/GEM200, GEM300 Standard, and WebAPI.
- Certified: SEMI S2/S8.