
Fully Automatic Dual Spindles Wafer Dicer- TS861Fully Automatic Dual Spindles Wafer Dicer- TS861
Intuitive operation to assist operators
Through the LCD touch panel, operators can perform calibration, readings, and other operations while viewing the microscope image. Additionally, by displaying charts of machine conditions and the MTBA (Mean Time Between Failures), operators can visually understand the machine's operating status. The screen also provides instructions for troubleshooting in case of abnormalities, assisting with fault diagnosis and resolution.
Product Specifications
Options for suppressing fine particle dust
- Dual-fluid nozzle for the cutting section
- Dual-fluid nozzle for the spinner section
- Water curtain on the worktable to prevent hardening caused by particle drying
- Strong exhaust duct (spindle)
Standard features
- Auto Kerf Check for automatic kerf correction
- NCS (Non-Contact Setup) for non-contact blade height measurement
- Blade Broken Detector for blade breakage detection
- Dual-fluid nozzle
Optional features
Hardware:
- In-line Dressing for online blade dressing
- Enhanced dust cleaning (Class 100)
- Laser Kerf Alignment with special CCD for kerf alignment
- CO2 machine (attachment)
- Chemical mixing equipment (attachment)
Software:
- Laser Kerf Alignment
- SECS/GEM
- Other customized software functions
Specification |
Unit |
TS861 |
|
(1.2/1.8/2.4Kw) |
|||
Max. workpiece size |
mm |
Φ200/Φ150 |
|
X-axis |
Cutting range |
mm |
210/160 |
Cutting speed |
mm/sec |
0.1-1,000 |
|
Y1、Y2-axis |
Cutting range |
mm |
210 |
Index step |
mm |
0.0001 |
|
Index positioning accuracy |
mm |
0.003/210 |
|
mm |
0.002/5(Single error) |
||
Z-axis |
Max. stroke |
mm |
14.2(For φ2”blade) |
Moving resolution |
mm |
0.0000003(24bit) |
|
Repeatability accuracy |
mm |
0.001 |
|
ϴ-axis |
Max. rotating angle |
deg |
380 |
Spindle |
Rated torque |
N.m |
0.27 |
Revolution speed range |
rpm |
6,000-60,000 |
|
Machine dimensions (W x D x H) |
mm |
1,250 x 1,600 x 1,890 |
|
Machine weight |
kg |
2,000 |