Semiconductor Industry

Workpiece Processing :

1. The gripper picks up the workpiece from the material storage box and transfers it to the pre-alignment station.
2. At the pre-alignment station, center alignment is performed, and the lower arm moves the workpiece to the worktable for cutting.
3. Cutting process takes place.
4. The upper arm moves the workpiece to the centrifugal cleaning station for cleaning and drying.
5. The lower arm transfers the workpiece back to the pre-alignment station.
6. The gripper returns the workpiece to the material storage box.

Improved Production Efficiency:

By adopting a dual-axis structure with opposing spindles and reducing the distance between the blade shafts, production efficiency is enhanced. NCS (Non-Contact Setup), implemented on Z1 and Z2 axes, significantly reduces the cutting pause time caused by height measurement setup.

Selectable Spindle Options:

The machine can be equipped with 1.2KW/1.8KW/2.4KW spindles. It is compatible with standard 2-inch blade holders and can also be equipped with 3-inch blade holders to accommodate higher loads for processing glass or ceramics.

Enhanced Ease of Operation:

The LCD touchscreen panel allows simultaneous use of the microscope view and calibration teaching functions. The Condition Monitor enables monitoring of processing conditions and various statuses. The machine also features a cutting water flow control function for managing flow rates on the operating screen.

Standard Features:

• Auto Kerf Check: Automatic kerf correction
• NCS (Non-Contact Setup): Non-contact blade height measurement

Optional Features:

• Hardware: Blade Broken Detector, Dual Fluid Nozzle, In-line Dressing, CO2 Unit (add-on), Chemical Mixing Equipment (add-on)
• Software: SECS/GEM, Other Customized Software Features